| 发明名称 |
THERMOCONDUCTIVE CURABLE LIQUID POLYMER COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED WITH THE USE OF THIS COMPOSITION |
| 摘要 |
<p>A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.</p> |
| 申请公布号 |
EP1509567(A1) |
申请公布日期 |
2005.03.02 |
| 申请号 |
EP20030733188 |
申请日期 |
2003.05.29 |
| 申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
YAMAKAWA, KIMIO;NAKAYOSHI, KAZUMI;ISHIKAWA, HIROKI;MINE, KATSUTOSHI |
| 分类号 |
C08K3/08;C08K3/22;C08L83/04;C09K5/14;H01L23/373;(IPC1-7):C08K7/00 |
主分类号 |
C08K3/08 |
| 代理机构 |
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