Printed circuit board having through-hole vias and micro-vias

摘要

A printed circuit board (PCB) for use with a ball grid array package (BGA) 15 comprises a plurality of etched copper layers and substrate layers, a grid of solder pads provided on an outer surface of the PCB for connection to the BGA and a grid of through hole vias 10 (TH via) which are situated between the solder pads. The TH vias are drilled, lined with a conductive layer and provided with a TH via pad situated beneath the surface. Each solder pad is electrically connected to an adjacent TH via in a layer beneath the outer surface. A micro-via 11 may be provided underneath each solder pad, and a copper layer etched to provide a connector 12 between the micro-via and the through hole via pad. A method of manufacture of the PCB is also claimed.