| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve heating properties and hence facilitate drilling by providing a heat dissipation metal plate on the upper surface side of a multi-layered substrate composed of a flexible film and a conductor circuit using the flexible film as an insulating substrate. SOLUTION: An electronic component mounting substrate 9 includes a multi- layered substrate 1 composed of electrically insulating flexible films 11 to 13, and two layers conductor circuits 31, 33 provided in the thickness direction of the flexible film, through-holes 110, 120, 130 passing through all of the flexible films 11 to 13, and a heat dissipation metal plate 2 provided on the upper surface side of the multi-layered substrate 1 so as to cover the through-holes. For this, the entire rigidity of the electronic component mounting substrate 9 is ensured with the aid of the heat dissipation metal plate 2. Thus, the heat dissipation metal plate 2 satisfactorily compensates for the lack of mechanical strength of the flexible films 11 to 13, and hence mechanical strength and durability of the electronic component mounting substrate are improved.</p> |
