Package for housing optoelectronic components

摘要

A package 40 for housing optoelectronic components (5,6,7) comprises an enclosed area 41 which is electrically connected to an open area 42, via tracks 4 through package wall 43. The enclosed area may house those components that need to be hermetically sealed, such as a laser diode. The enclosed area may be sealed using a lid (not shown). The package may be made from stacked ceramic layers. The components may be wire bonded to the base 47 of the package, which may or may not be on the same plane in both areas. The package may be connected to an external PCB 70 via interface 60. The package may be used in an electrooptical module (such as a transmitter in an optical communication system) which may operate at a speed of at least 10Gb/s.