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发明名称
化学机械研磨用之水性分散体及化学机械研磨方法
摘要
本发明有关一种化学机械研磨用水性分散体,包括研磨粒成分(A)、选自羧酸及啶羧酸之至少一种之成分(B)、羧酸及啶羧酸以外之有机酸之成分(C)、及氧化剂之成分(D),其中成分(B)之含量(WB)与成分(C)之含量(WC)之质量比(WB/WC)为0.01(含)以上且小于2,氨及铵离子所构成之氨成分浓度为0.005莫耳/升(含)以下。该化学机械研磨用水性分散体在对各种被加工层各以高效率研磨之同时,可获得充分平坦化之高精确度之修饰表面。
申请公布号
TW200508376
申请公布日期
2005.03.01
申请号
TW093119924
申请日期
2004.07.01
申请人
JSR股份有限公司;东芝股份有限公司
发明人
内仓和一;西元和男;服部雅幸;川桥信夫;矢野博之;松井之辉;南幅学;福岛大;仓延行
分类号
C09K3/14
主分类号
C09K3/14
代理机构
代理人
周登龙
主权项
地址
日本
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