发明名称 Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices
摘要 In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of the cured product.
申请公布号 US6861655(B2) 申请公布日期 2005.03.01
申请号 US20030340781 申请日期 2003.01.13
申请人 SONY CHEMICALS CORP. 发明人 KUMAKURA HIROYUKI
分类号 C09J9/00;C09J201/00;G01N21/64;H05K1/02;H05K3/00;H05K3/30;H05K3/32;(IPC1-7):G01N21/64 主分类号 C09J9/00
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