发明名称 Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths
摘要 A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.
申请公布号 US6861744(B2) 申请公布日期 2005.03.01
申请号 US20020074792 申请日期 2002.02.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HAYAMA MASAAKI;MOURI NOBORU;MATSUNAGA HAYAMI
分类号 H01L21/48;H01L21/56;H01L23/12;H05K1/03;H05K1/09;H05K3/12;H05K3/20;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H01L23/12;H01L21/44 主分类号 H01L21/48
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