发明名称 |
Minimum metal consumption power distribution network on a bonded die |
摘要 |
A method for minimum metal consumption power distribution includes the steps of forming a circuit having a plurality of circuit components on an electrically insulated substrate and forming a plurality of supply voltage regulators on the electrically insulating substrate wherein each of the plurality of supply voltage regulators is located adjacent to each of the plurality of circuit components respectively, and each of the plurality of supply voltage regulators is connected to each of the plurality of circuit components respectively for generating a regulated voltage rail output to each of the plurality of circuit components respectively. |
申请公布号 |
US6861739(B1) |
申请公布日期 |
2005.03.01 |
申请号 |
US20010858686 |
申请日期 |
2001.05.15 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
BHAVNAGARWALA AZEEZ J.;KAPOOR ASHOK K. |
分类号 |
H01L23/528;H01L23/58;(IPC1-7):H01L23/58 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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