发明名称 |
Method and apparatus for preparing semiconductor wafers for measurement |
摘要 |
A wafer-cleaning module can remove contaminants from a semiconductor wafer prior to measurement in a metrology tool. A heating chamber and heater plate of the cleaning module can be used to heat the wafer by conduction, while a separate cooling chamber can be used to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers. |
申请公布号 |
US6861619(B1) |
申请公布日期 |
2005.03.01 |
申请号 |
US20030625407 |
申请日期 |
2003.07.23 |
申请人 |
THERMA-WAVE, INC. |
发明人 |
HOWELL MICHIAL DUFF;BOWMAN BARRY ROY |
分类号 |
H01L21/00;H01L21/66;(IPC1-7):H05B3/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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