发明名称 Method and apparatus for preparing semiconductor wafers for measurement
摘要 A wafer-cleaning module can remove contaminants from a semiconductor wafer prior to measurement in a metrology tool. A heating chamber and heater plate of the cleaning module can be used to heat the wafer by conduction, while a separate cooling chamber can be used to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
申请公布号 US6861619(B1) 申请公布日期 2005.03.01
申请号 US20030625407 申请日期 2003.07.23
申请人 THERMA-WAVE, INC. 发明人 HOWELL MICHIAL DUFF;BOWMAN BARRY ROY
分类号 H01L21/00;H01L21/66;(IPC1-7):H05B3/68 主分类号 H01L21/00
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