CATHODIC SPUTTERING APPARATUS FOR INCREASING MAGNETIC FIELD INTENSITY IN REGION OF TARGET ACTIVE ZONE AND ENLARGING ACTIVE ZONE TO INCREASE SPUTTERING RATE AND LOWER THERMOELECTRIC POWER DENSITY

摘要

PURPOSE: To provide a cathodic sputtering apparatus which is designed in such a manner that magnetic field intensity is increased in a target erosion generated region of target active zone, and which increases area of the active zone to increase sputtering rate of target material and lower thermoelectric density flown into the target material at the same time. CONSTITUTION: In a cathodic sputtering apparatus(8) for coating a substrate in vacuum, the apparatus comprising a basically tubular support for a sputtering material which is rotatable around a shaft longitudinally installed; a magnet system comprising pole shoes(9,10), magnet yokes formed of magnetically permeable metal and a magnetization means(5) for properly generating magnetic flux, wherein the magnetic system is extended along a longitudinal shaft to magnetically confine plasma installed adjacently to a target(2) formed of the sputtering material; a cooling system connected to a cooler on an outer part of the support to properly rotate a cooling medium in the tubular support; a unit for connecting the target to a power supply circuit; and a unit for rotationally driving the tubular support that is rotatable around the longitudinal shaft, the cathodic sputtering apparatus is characterized in that magnetic poles of one polarity of the magnet system are placed on an outer part of the rotatable tubular support such that the magnet system encircles the support.