METHOD AND JIG FOR PICKING UP DIES WITH COLLET FOR PICKING UP THE DIES

摘要

PURPOSE: A method and a jig for picking up dies are provided to reduce pick-up operation time by performing die pick-up operation using a collet right after the die arrives at a pick up center. CONSTITUTION: A method for picking up a die uses a collet(4) and a vacuum stage(6). The collet is vertically movable and sucks in the dies(1A,1B,1C) on a wafer sheet(2). The vacuum stage sucks in the wafer sheet. A protruding surface(21) is formed on an upper surface of the vacuum stage on a feeding side in a direction to a pick up center. The wafer sheet, which is sucked in by the vacuum stage, is transferred such that the die to be picked up is positioned in the die pickup center. The die is picked up to be separated from the wafer sheet by the collet.