METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR USE THEREIN

摘要

A method for manufacturing a semiconductor device of the present invention, comprises the steps of mounting and bonding semiconductor chips onto die pads of a metal lead frame having an outer pad side to which a heat-resistant pressure-sensitive adhesive tape is attached; wiring a bonding wire between each termination of the lead frame and each electrode pad on the semiconductor chips sealing semiconductor chips in a sealing resin from one side; and cutting the sealed body into individual semiconductor devices. In this invention the heat-resistant pressure-sensitive adhesive tape comprises a base layer made of a polyimide resin and a pressure-sensitive adhesive layer with a thickness of I to 20 &mgr; m that is made of an acrylic resin and has a storage elastic modulus of at least 1.0 x 105 pa at 20 DEG C.