| 发明名称 |
PROCESS FOR MECHANICAL CHEMICAL POLISHING OF A LAYER IN A COPPER-BASED MATERIAL |
| 摘要 |
PROCESS FOR MECHANICAL CHEMICAL POLISHING OF A LAYER IN A COPPER-BASED MATERIAL USING A POLISHING COMPOSITION, CHARACTERIZED IN THAT SAID POLISHING COMPOSITION COMPRISES AN AQUEOUS SUSPENSION OF INDIVIDUALIZED COLLOIDAL SILICA PARTICLES NOT LINKED TO EACH OTHER BY SILOXANE BONDS, THE AVERAGE DIAMETER OF WHICH IS COMPRISED BETWEEN 10 AND 100 NM, THE PH OF THE AQUEOUS SUSPENSION BEING COMPRISED BETWEEN 1 AND 5.FIGURE 2
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| 申请公布号 |
MY118930(A) |
申请公布日期 |
2005.02.28 |
| 申请号 |
MYPI9902917 |
申请日期 |
1999.07.10 |
| 申请人 |
AZ ELECTRONIC MATERIALS USA CORP. |
发明人 |
JACQUINOT ERIC;LETOURNEAU PASCAL;RIVOIRE MAURICE |
| 分类号 |
B24B1/00;B24B37/04;C09G1/02;C09K3/14;H01L21/302;H01L21/304;H01L21/306;H01L21/321;H01L21/768 |
主分类号 |
B24B1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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