COMPACT IMAGING MODULE FOR ACHIEVING MINIATURIZATION SIMILAR TO MID SYSTEM AND INSTALLATION OF CMOS HAVING PLURAL PIXELS

摘要

PURPOSE: A compact imaging module is provided to achieve miniaturization similar to a MID system and installation of CMOS having a plurality of pixels by combining a resin case with an existing circuit substrate. CONSTITUTION: A case(11) has a lens holding barrel part(11a). An optical system member is contained in the lens holding barrel part. A circuit substrate(13) having a wiring pattern(14) is disposed in an image side of the optical system member. A plurality of electrodes(17a,17b,17c) are disposed on the circuit substrate. An imaging sensor(1) is mounted on a surface of the circuit substrate to connect the electrodes disposed on the circuit substrate. A frame member(15) is provided on a periphery of the circuit substrate. The case includes a substrate-mounting surface having a sensor window. The circuit substrate is attached to the substrate-mounting surface of the case. The frame member includes conductive electrodes to guide out a signal of the imaging sensor mounted on the circuit substrate through the electrodes disposed on the circuit substrate.