| 摘要 |
<p>An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable functional groups in the molecule, and a cross-linking agent therefor 5 to 30 parts by weight b. an epoxy resin that is liquid at room temperature 5 to 30 parts by weight c. a compound having the structure shown in Formula 1 40 to 90 parts by weight <CHEM> where R is H or <CHEM></p> |
