SEMICONDUCTOR DEVICE AND FABRICATING METHOD FOR IMPROVING PRODUCTIVITY AND ENHANCING RELIABILITY THEREOF

摘要

PURPOSE: A semiconductor device and a fabricating method thereof are provided to improve productivity and reliability by preventing generation of cracks and on a glass substrate and separation between a semiconductor chip and a semiconductor substrate. CONSTITUTION: A supporter is attached by using an adhesive in order to coat a couple of first wires arranged in both sides of a boundary region between the semiconductor chips of a semiconductor substrate(302). A first insulating layer is exposed by etching partially the semiconductor substrate. A second insulating layer is formed on a second surface of the semiconductor substrate. A first wire is exposed by selectively etching the first and second insulating layers. A couple of second wires connected to the first wires are formed on the second surface of the semiconductor substrate. A groove is formed in the second surface of the semiconductor substrate along the boundary region. The semiconductor substrate is divided into individual semiconductor chips by performing a dicing process.