发明名称 RESIST PATTERN THICKENING MATERIAL, PROCESS OF FORMING RESIST PATTERN, AND PROCESS OF FABRICATING SEMICONDUCTOR DEVICE TO THICKEN EFFICIENTLY RESIST PATTERN
摘要 <p>PURPOSE: A resist pattern thickening material, a process of forming a resist pattern, and a process of fabricating a semiconductor device are provided to thicken efficiently a resist pattern by utilizing ArF excimer laser light as exposure light during a patterning period. CONSTITUTION: A resist pattern thickening material includes a resin and a phase transfer catalyst. The resist pattern thickening material exhibits at least one of water-solubility and alkali-solubility. The phase transfer catalyst is formed with an onium salt compound. The onium salt compound is at least one of a quaternary ammonium salt, a pyridinium salt, a thiazolium salt, a phosphonium salt, a piperazinium salt, an ephedrinium salt, a quininium salt, and a cinchoninium salt.</p>
申请公布号 KR20050016115(A) 申请公布日期 2005.02.21
申请号 KR20040061170 申请日期 2004.08.03
申请人 FUJITSU LIMITED 发明人 KOZAWA, MIWA;NOZAKI, KOJI
分类号 H01L21/32;G03F7/00;G03F7/40;G11B5/17;G11B5/31;H01L21/027;H01L21/033;H01L21/311;H01L21/3213;H01L21/8247;H01L27/115;(IPC1-7):H01L21/32 主分类号 H01L21/32
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