| 摘要 |
A method for manufacturing an optical device (40, Figure 2) for example, a laser diode, optical modulators, optical amplifiers , optical detectors or optical switches, uses a body portion 5 which includes a Quantum well structure 30. The method includes a processing step to create extended defects at least in a portion of the device body portion. The method may comprise sputtering from the body device portion using a magnetron sputterer (65, Figure Figure 7) which provides a magnetic field around the device body portion. The method may include depositing a dielectric layer 51 on at least one other portion of the body device portion to act as a mask. A further dielectric layer 60 may be deposited on the first dielectric layer 51 and/or on the at least one portion of the device body portion. The dielectric layer 51 and a further dielectric layer 60 may comprise silica or aluminium oxide. The step of depositing the dielectric layer may form part of a Quantum well intermixing process comprising Impurity Free Vacancy Disordering. The device may be annealed. The first optional cladding layer 15, core guiding layer 20 and second optical cladding layer 25 may be grown by Molecular Beam Epitaxy, or Metal Organic Chemical Vapour Deposition. The device may be fabricated from a Gallium Arsenide system operating at a wavelength between 600 and 1300 nm. Alternatively, the device may be fabricated from an Indium Phosphide based system operating at a wavelength of between 1200 and 1700 nm. The optical device may be included in an optical integrated circuit, or an optoelectronic integrated circuit, or a photonic integrated circuit. |
