SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein enough connection strength is ensured without damaging a semiconductor element when the semiconductor element and a printed board are electrically connected using a flip chip packaging method and an ultrasonic bonding method. SOLUTION: For the configuration of the connection terminal of the printed board, the length of the connection terminal in the direction of the vibration of a horn in ultrasonic bonding is made longer than in a direction perpendicular to the horn vibration direction. For the semiconductor element a protruded electrode is formed to satisfy a relation: 0.75≤(D/W)≤0.875 when a shorter width of an electrode pad is assumed W and the maximum diameter of the protruded electrode D when it is cut along a plane parallel to the electrode pad. COPYRIGHT: (C)2005,JPO&NCIPI