摘要 |
PROBLEM TO BE SOLVED: To facilitate the selection of an image in which the feature of a defect is best reflected, in a defective image selecting device, a defective image selecting method and a defective image selecting system which are employed upon analyzing a defect generated in the manufacturing process of a semiconductor wafer. SOLUTION: At least one of defective images to be selected in each observation process one by one or a representative defective image in a process in which the feature of defect among the image data in respective observation processes is best reflected, and a representative defective image between processes in which the feature of defect is best reflected among the image data of representative defective image in respective processes in each defects, is selected automatically by an automatic selecting unit based on a predetermined rule. COPYRIGHT: (C)2005,JPO&NCIPI
|