| 摘要 |
PROBLEM TO BE SOLVED: To permit sure dividing of a substrate by fully working out the cutter edge even when a force applied on a mold upon dividing the same is small, and further, to facilitate the miniaturization of a device itself and the handling of the mold. SOLUTION: The substrate partitioning device is constituted of a table 21 for mounting the substrate 10, a substrate pushing unit for retaining the substrate 10 on the table 21, and the cutter edge for dividing a part 12 along a groove 11 by pushing the part 12 of the substrate 10. In this case, the cutter edge 23 is provided in a lengthwise direction X along the groove 11 of the substrate 10 mounted on the table 21, while the edge 23a of the edge 23 is provided so as to be slanted with respect to the surface 10a of the substrate 10 by an angle of inclination of (θ1). COPYRIGHT: (C)2005,JPO&NCIPI
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