发明名称 SOLDER HEATING IMPLEMENT, AND CHIP OF ITS TIP
摘要 PROBLEM TO BE SOLVED: To provide a solder heating implement economical in such a manner that only an inexpensive heating part can be replaced further, having satisfactory heat conductivity among a temperature detection part, a heater and a heating part, and free from time lag between the temperature measurement in the heating part and heating. SOLUTION: The heating implement is provided with: a bar-shaped ceramic heater 2 generating heat for heating solder; a sleeve 3 consisting of a highly thermal conductive material, covering the circumference of the ceramic heater 2 and also tightly stuck to the ceramic heater 2; and a heating part 4 fitted exchangeably to the tip of the ceramic heater 2 and receiving heat from the sleeve 3 by being abutted on a heat transmitting face 3a provided on the tip of the sleeve 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005040861(A) 申请公布日期 2005.02.17
申请号 JP20040193334 申请日期 2004.06.30
申请人 HAKKO KK 发明人 MASAKI HIROYUKI;TERAOKA YOSHITOMO
分类号 B23K3/02;B23K3/03;(IPC1-7):B23K3/02 主分类号 B23K3/02
代理机构 代理人
主权项
地址