| 摘要 |
A semiconductor integrated circuit device realizing high integration and a simplified manufacturing process. The circuit includes a gate insulator with a first film thickness, a first N-channel MOSFET and a first P-channel MOSFET, in which a polysilicon layer consists of a gate electrode including an N-type impurity dose, and a gate insulator with a second film thickness thinner than the first film thickness. The circuit also includes a second N-channel MOSFET and a second P-channel MOSFET in which the polysilicon layers are doped with N-type impurity and P-type impurity, respectively. Gate electrodes of said first N-channel MOSFET and first P-channel MOSFET are formed as one body and connected to each other.
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