| 摘要 |
A die pickup method and device including a collet 4 that vacuum-chucks dies 1A, 1B, IC . . . , which are on a wafer sheet 2, and a suction stage 6, which vacuum-sucks this wafer sheet 2. A protruding surface 21 is formed on the upper surface of the suction stage 6 so that it is located on the feeding (upstream) side in the direction in which dies are fed to the die pickup center 5 of the suction stage 6. The wafer sheet 2 being vacuum-sucked by the suction stage 6 is fed so that a die 1A that is to be picked up is moved toward the die pickup center 5, thus allowing the die 1A to be separated from the wafer sheet 2 as the die 1A passes the protruding surface 21, and then the die 1A is vacuum-chucked and picked up by the collet 4.
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