发明名称 |
Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate |
摘要 |
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more electrolytes are disposed between the electrodes and the microelectronic substrate to electrically link the electrodes to the microelectronic substrate. The electrodes are then coupled to a source of varying current that electrically removes the conductive material from the substrate. The microelectronic substrate and/or the electrodes can be moved relative to each other to position the electrodes relative to a selected portion of the microelectronic substrate, and/or to polish the microelectronic substrate. The material removal medium can remove gas formed during the process from the microelectronic substrate and/or the electrodes. The medium can also have different first and second electrical characteristics to provide different levels of electrical coupling to different regions of the microelectronic substrate.
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申请公布号 |
US2005034999(A1) |
申请公布日期 |
2005.02.17 |
申请号 |
US20040926202 |
申请日期 |
2004.08.24 |
申请人 |
LEE WHONCHEE;MEIKLE SCOTT G.;MOORE SCOTT E. |
发明人 |
LEE WHONCHEE;MEIKLE SCOTT G.;MOORE SCOTT E. |
分类号 |
B23H3/00;B23H5/08;B24B1/00;B24B7/19;H01L21/8242;H01L29/00;(IPC1-7):H01L29/00 |
主分类号 |
B23H3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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