| 摘要 |
A silicone-based encapsulant is provided. The encapsulant is ideal for encapsulating LEDs that emit light in the blue through ultraviolet spectrum, displays a high transmittance as well as excellent light resistance and heat resistance, is hard and resistant to cracking, and displays little shrinkage during molding. The LED encapsulating composition that forms a resin on curing, comprises: (a) a polyorganosiloxane component, which comprises at least one polyorganosiloxane and has an average composition formula represented by (R<1>R<2>R<3>SiO1/2)M. (R<4>R<5>SiO2/2)D. (R<6>SiO3/2)T. (SiO4/2)Q (wherein, R<1> to R<6> are identical to or different from each other, and each represent a group selected from the group consisting of an organic group, a hydroxyl group, and a hydrogen atom, and at least one of R<1> to R<6> is either a hydrocarbon group with a multiple bond, and/or a hydrogen atom, M, D, T, and Q each represent a number within a range from 0 (inclusive) to 1 (exclusive), M+D+T+Q =1, and Q+T >0); and (b) an addition reaction catalyst in an effective quantity.
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