| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring by which the drop of the machining accuracy due to etching, an exposing step, etc., performed for forming recessed sections for wiring can be prevented to the utmost and, at the same time, the electron migration resistance of the wiring can be improved at the time of forming multilayered wiring and, in addition, the reliability of a device can be improved. SOLUTION: After recessed sections for the wiring are formed in an insulating film formed on the surface of a substrate, metallic films composed of a wiring material are formed on the surface of the insulating film by embedding the wiring material in the recessed sections. Then wiring is formed by removing the excessive metallic materials other than those in the recessed sections and flattening the surface of the substrate, and a first protective film composed of a conductive material is selectively formed on the exposed surface of the wiring. Moreover, a second protective film is formed on the surface of the substrate on which the first protective film is formed and an interlayer insulating layer is formed on the surface of the substrate on which the second protective film is formed. Finally, the surface of the interlayer insulating film is flattened. COPYRIGHT: (C)2005,JPO&NCIPI |
