| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical space modulation element capable of proper transfer exposure even for a chip pattern in the vicinity of an edge of a wafer, and increasing the number of times of chip transfer. SOLUTION: The pattern A of a chip pattern 1 located in the vicinity of the edge 41a of a wafer 41 and the pattern C of a chip pattern 2 located in the vicinity of an edge 41b existent at a diagonal position on the wafer 41 are transferred. Thereupon, a mask 2 is used to transfer the patterns A, C, and the position of an optical axis 10 is located within the range of the wafer 41. Consequently, the transfer is achieved in the state where the leveling focusing information is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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