| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist coater which can prevent the re-adhesion of a resist mist to a wafer by suppressing the occurrence of the resist mist, and to provide a method of applying resist and a method of manufacturing semiconductor device. SOLUTION: The resist coater is a resist sputtering device which forms a resist film on a wafer WF by sputtering. The coater is provided with a holder 12 which is disposed in a vacuum vessel 11 and holds the wafer WF, and a backing plate 15 which is also disposed in the vacuum vessel and holds a resist target 14 which is provided to face the holding section 12. Since this resist coater forms the resist film on the wafer WF by sputtering which is completely different from the conventional resist coater, the occurrence of the resist mist can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI
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