| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a heating resistor in which resistance distribution can be improved while suppressing increase in resistance of a heating resistor layer, and to provide a process for manufacturing an ink jet recording head. SOLUTION: An Si oxide film 75 (first insulation layer), a polycrystal Si film 74 (etching stopper layer), and an Si oxide film 73 (first insulation layer) are formed sequentially on a heating resistor layer (N), and then the Si oxide film 73, the polycrystal Si film 74 and the Si oxide film 75 are removed sequentially by plasma etching under respective etching conditions to form an opening in a partial region of the heating resistor layer 6 ((O)-(Q)). COPYRIGHT: (C)2005,JPO&NCIPI
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