| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simplify and facilitate a work requiring workmanship and skill such as processing of spot facing or burying and connection by manual soldering in arranging a circuit element and to improve high frequency characteristic, in arrangement of the circuit element in the circuit device of a laminated substrate. <P>SOLUTION: The circuit device 10 is provided which uses a laminated substrate in which resistors of circuit elements 22, 24 are arranged dividedly on the surface layers of both surfaces of the laminated substrate on which insulating layers 13, 14 are laminated and the resistors are connected to predetermined positions of a line pattern 12 via piercing through holes 30. With this device, low cost is achieved by mass production and simplification in manufacturing and the high frequency characteristic is improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
