发明名称 POWER CONVERTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a small-sized and high-durability power converting device equipped with a cooling means for a semiconductor module constituting a power converting circuit. SOLUTION: The power converting device 1 includes the semiconductor module 10 constituting the power converting circuit, and a cooling tube 20 which forms a flow passage of a refrigerant cooling the semiconductor module 10. The power converting device 1 has a semiconductor laminated unit 2 and a guide unit 50. The semiconductor laminated unit 2 is constituted by laminating cooling tubes 20 in a flat shape and semiconductor modules 10 alternately, and both the ends of each cooling tube 20 are linked with a couple of headers constituting a supply side and a discharge side for the refrigerant. The guide unit 50 has a couple of guide surfaces arranged opposite to a surface and a reverse surface that edges in the lengthwise direction of each cooling tube 20 of the semiconductor laminated unit 2 form across a specified gap along the width. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005045186(A) 申请公布日期 2005.02.17
申请号 JP20030280352 申请日期 2003.07.25
申请人 DENSO CORP 发明人 OYAMA YOSHIHIKO
分类号 H01L23/473;(IPC1-7):H01L23/473 主分类号 H01L23/473
代理机构 代理人
主权项
地址