发明名称 THERMOPLASTIC RESIN SHEET AND CONTAINER FOR TRANSPORTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic sheet which gives a molded article having excellent dimensional stability, when molded, especially when used as a carrier tape, and to provide an electronic part transportation container comprising the same. SOLUTION: The thermoplastic resin sheet is characterized by having an absolute value difference of≤6 % between thermal expansion coefficients in the MD and TD directions of the sheet at a molding temperature, having thermal expansion coefficients of≤12×10<SP>-5</SP>/°C in the MD and TD directions of the sheet, respectively, at a temperature of 20 to 30°C, and having a thickness of 0.1 to 1.0 mm. A molded article having excellent dimensional stability is obtained by using the thermoplastic resin sheet. The electronic part transportation container comprises the thermoplastic resin sheet. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005041930(A) 申请公布日期 2005.02.17
申请号 JP20030200658 申请日期 2003.07.23
申请人 SUMITOMO BAKELITE CO LTD 发明人 ISHIDA YUSUKE;YONEZAWA MASATERU
分类号 B65D73/02;B65D85/86;C08J5/18;(IPC1-7):C08J5/18 主分类号 B65D73/02
代理机构 代理人
主权项
地址