| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, and to provide a semiconductor device. SOLUTION: This epoxy resin composition for sealing semiconductors, containing (A) an epoxy resin, (B) a phenolic resin-silica composite material obtained by synthesizing the phenolic resin in a solution containing the silica particles having a size of 100 nm to 500 nm, (C) a curing accelerator, and (D) an inorganic filler as essential components, is characterized in that the content of the silica in the phenolic resin-silica composite material is 10 to 40 wt. %. COPYRIGHT: (C)2005,JPO&NCIPI
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