发明名称 |
JOINING STRUCTURE OF WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a joining structure which enhances the tensile strength of connecting section of wiring boards by geometrical configuration arrangement, and which connects the wiring boards for preventing deformation and damage of a joining section between the wiring boards. SOLUTION: In the joining structure which connects the wiring boards, this joining structure comprises a first wiring board 60 in which at least one or more concavities 68 are formed, and a second wiring board 70 in which at least one or more protrusions 78 are formed. The concavities 68 of the first wiring board 60 and the protrusions 78 of the second wiring board 70 are complementarily joined. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005045233(A) |
申请公布日期 |
2005.02.17 |
申请号 |
JP20040201692 |
申请日期 |
2004.07.08 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHO SUNG-DAE;LEE JOO-HYOUNG |
分类号 |
H01L21/60;B65D85/30;H01L23/13;H05K1/00;H05K1/14;H05K3/00;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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