| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring by which the electron migration resistance of the wiring can be improved by covering the exposed surface of the wiring with a highly adhesive protective film and, in addition, the reliability of a device can be improved. SOLUTION: The wiring, the surface of which is protected with first protective films, is formed by providing recessed sections for wiring on an insulating film formed on the surface of a substrate and forming metallic films composed of a wiring material on the surface of the insulating film by embedding the wiring material in the recessed sections. Then first protective films composed of a conductive material are formed on the surfaces of the metallic films, and the surface of the substrate is flattened by removing excessive metallic materials other than those in the recessed sections. COPYRIGHT: (C)2005,JPO&NCIPI
|
