COOLING DEVICE OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a cooling device for efficiently cooling a semiconductor element. SOLUTION: A plurality of spouting pipes 25 are provided under the semiconductor element 12. Cylindrical heat radiating fins 26 surrounding each pipe 25 are provided from a lower surface of an upper plate of a case 41 down below. A coolant spouted out from each pipe 25 is strongly spouted to the lower surface of the upper plate under the semiconductor element 12, and then flowing around a gap between the spouting pipes 25 and the heat radiating fins 26 and falling down the heat radiating fins 26. A flow velocity of the coolant flowing the lower surface of the upper plate and the heat radiating fins 26 is fast to be able to absorb the heat from the semiconductor element with high heat transfer coefficient. COPYRIGHT: (C)2005,JPO&NCIPI