发明名称 MASK FOR PARTIAL SOLDERING, AND PARTIAL SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a partial soldering mask and a partial soldering method for conducting the soldering without generation of solder bridge between terminals. SOLUTION: A mask 20 is provided with an aperture 22 including tapered surfaces 25, 26. A copper foil 27 ensuring excellent wettability to the fused solder is provided between lands 14b on the tapered surface located at the rear position of the moving direction (arrow mark 30) of a circuit board 10 at the time of soldering. The mask 20 is soldered to the circuit board 10 using a wave soldering apparatus 5. When the circuit board 10 moves, the secondary injection 2 attracts fused solder 4 adhered to the copper foil 27. The fused solder 4 attracted to the secondary injection 2 attracts the fused solder 3 adhered to the area between the lands 14b. Accordingly, since the fused solder 3 adhered to the area between the lands 14b is removed, generation of solder bridge at the area between the lands 14d can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005044998(A) 申请公布日期 2005.02.17
申请号 JP20030277320 申请日期 2003.07.22
申请人 NISSAN MOTOR CO LTD 发明人 HATAKEYAMA TOSHIYUKI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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