| 摘要 |
PROBLEM TO BE SOLVED: To prevent troubles due to slurry by suppressing adhesion of the slurry in a polishing chamber. SOLUTION: The polishing chamber 10 surrounding a semiconductor wafer 1, a chuck 2, a spindle 3 serving as a movable component of a chuck rotating mechanism, polishing pads 4a and 4b, and rods 5a and 5b serving as movable components of a polishing pad pushing mechanism and having a hydrophilic inner wall is provided. Pure water is sprinkled within the polishing chamber 10 from a pure water spray 11 before polishing. A switch valve 15 has a drain line 13 opened and a recycle line 14 closed at this time. The pure water from the spray 11 is suspended while polishing, and slurry is fed from a slurry nozzle 12 to between the semiconductor wafer 1 and the polishing pads 4a and 4b. The switch valve 15 has the drain line 13 closed and the recycle line 14 opened at this time. After the polishing, the pure water is sprinkled within the polishing chamber 10 from the pure water spray 11. At this time the switch valve 15 opens the drain line 13 and closes the recycle line 14. COPYRIGHT: (C)2005,JPO&NCIPI
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