发明名称 CUTTING BLADE AND MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a cutting blade capable of certainly cutting a ceramic block at a predetermined position without producing the shift of a cutting target line with an actual cutting position (cutting line) or the adhesion of ceramic to the cutting blade, and a manufacturing method for a laminated ceramic electronic part equipped with a process for cutting the ceramic block using the cutting blade. SOLUTION: A plurality of grooves 4a having an angle of 20-70°with respect to the penetration direction into the ceramic block 3 and a plurality of grooves 4b having an angle of -20 to -70°are formed to both main upper and under surfaces of the cutting blade A so as to cross each other. By forming a plurality of grooves having the angle of 20-70°with respect to the penetration direction into the ceramic block to one of both main upper and under surfaces and the other one of them, the grooves formed to one of both main upper and under surfaces and the grooves formed to the other one of them are set to a state crossing each other so as to hold the cutting blade. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005041056(A) 申请公布日期 2005.02.17
申请号 JP20030201834 申请日期 2003.07.25
申请人 MURATA MFG CO LTD 发明人 SHIMADA TOMOKAZU;SAITO AKIRA;NISHIYAMA TOSHIKI;NOMICHI TAKASHI
分类号 B28D1/22;B28B11/14;H01G4/30;H01G13/00;(IPC1-7):B28D1/22 主分类号 B28D1/22
代理机构 代理人
主权项
地址
您可能感兴趣的专利