| 摘要 |
A frame transfer prober 1, for carrying out an electrical property test on a number of semiconductor chips 10 fixed on a dicing tape 11, comprises a separation detection unit 9 for detecting the separation and/or protrusion of the semiconductor chips 10 from the dicing tape. The separation detection unit has a light emitting portion 91 for emitting a laser beam L, a light receiving portion 92 for receiving the laser beam L so emitted and a determination portion 93 for determining the separation and/or protrusion of the semiconductor chips through an increase or decrease in amount of the laser beam L so received.
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