| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To detect an increase in the contact resistance between a probe and an electrode pad by accurately measuring the contact resistance of the probe with a small chip occupancy rate. <P>SOLUTION: In the inspection method of a probe for inspecting the probe by using a wafer chip 100 having a resistor 20 connected to an electrode pad 30 and a ground potential terminal, the resistance between the ground potential terminal and the probe brought into contact with the electrode pad is measured, so that the contact resistance between the electrode pad and the probe is measured. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
