发明名称 MULTILAYER BODY AND ITS PRODUCING PROCESS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer body such as a printed wiring board, especially a flexible wiring board, having an IVH structure in which a conductor is secured rigidly into an IVH even if it is subjected to stress or bending due to working environment and good connection reliability is ensured over a long term. <P>SOLUTION: The multilayer body comprises a film 1, first and second resin layers 2 and 3 having at least one layer formed on the opposite sides of the film 1, first and second wiring patterns 4 and 5 formed on the surface of the first and second resin layers 2 and 3, contact holes provided in the first and second resin layers and the film such that the contact hole in the film has a diameter larger than that in the resin layer in order to connect the first and second wiring patterns 4 and 5 electrically, and a conductor formed to clamp the film in the contact hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005045008(A) 申请公布日期 2005.02.17
申请号 JP20030277397 申请日期 2003.07.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAMURA SADASHI
分类号 B23K26/00;B23K101/42;H05K1/03;H05K1/11;H05K3/00;H05K3/46;(IPC1-7):H05K1/11 主分类号 B23K26/00
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