REACTIVE SPUTTERING DEPOSITION DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a reactive sputtering deposition device provided with a partition plate between a sputtering target and a substrate. SOLUTION: In the reactive sputtering deposition device, the partition plate is provided between the target and the substrate, a vapor deposition chamber is divided into a substrate-side reaction chamber and a target-side sputtering chamber and a hole enabling a metallic substance separated from the target to reach the substrate is formed at the central part of the partition plate. Thus, a metal oxide thin film can be deposited at high speed on the substrate since the oxidation of the metallic target is prevented by minimizing the movement of a reactive gas to the metallic target. COPYRIGHT: (C)2005,JPO&NCIPI