发明名称 PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME
摘要 <p>The invention provides an undercut-free conductor circuit which can be produced by additive process without dry processing or dry processing device, and a method of producing the same. The printed wiring board of the invention has an undercut-free conductor circuit produced by performing additional plating to fill an undercut.</p>
申请公布号 WO2005015966(A1) 申请公布日期 2005.02.17
申请号 WO2004JP11535 申请日期 2004.08.11
申请人 FUJIKURA LTD.;FUJINAMI, HIDEYUKI;HIGUCHI, REIJI;KOBAYASHI, KAZUHARU 发明人 FUJINAMI, HIDEYUKI;HIGUCHI, REIJI;KOBAYASHI, KAZUHARU
分类号 H05K3/06;H05K3/10;(IPC1-7):H05K3/18;H05K3/22 主分类号 H05K3/06
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