| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and an electronic apparatus which can be provided economically with a stand-off by making unnecessary the job and mounting jig required for processing a fixing member. <P>SOLUTION: In the semiconductor device 1, a lead pin 20 extending downward from the lower surface of the package 5 is provided, and this lead pin 20 is inserted actually into a mounting hole of a printed circuit board. A thermo-compressing tube 60 formed of a heat-resistant resin having conductivity is inserted into the side of package 5 of the lead pin 20. Thereafter, the thermo-scompessing tube 60 is heated to be compressed and the thermo-compressing tube 60 is fixed to the lead pin 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
