| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor differential pressure measuring device having an excessive pressure protection means and a damping means in a sensor chip. SOLUTION: The semiconductor differential pressure measuring device is equipped with a recession which is provided in a semiconductor chip, constitutes a diaphragm of a strain producing section in this semiconductor chip, is equipped with a damping means which has a supporting stand arranged in the recession being opposed to the diaphragm keeping a clearance, and a sealed liquid put in the clearance. COPYRIGHT: (C)2005,JPO&NCIPI
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