,申请号JP20030528537-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称
摘要
申请公布号	JP2005504798(A)	申请公布日期	2005.02.17
申请号	JP20030528537	申请日期	2002.09.06
申请人		发明人
分类号	A61K31/603;A61K31/137;A61K31/46;A61P9/00;A61P11/00;A61P11/06;A61P11/08;A61P15/06;C07C217/10;(IPC1-7):C07C217/10	主分类号	A61K31/603
代理机构		代理人
主权项
地址

您可能感兴趣的专利

RAISED SOURCE/DRAIN EPI WITH SUPPRESSED LATERAL EPI OVERGROWTH

DEVICE ARCHITECTURE AND METHOD FOR IMPROVED PACKING OF VERTICAL FIELD EFFECT DEVICES

SUBSTRATE STRUCTURE AND SEMICONDUCTOR DEVICE ON THE SUBSTRATE STRUCTURE

SILICON CARBIDE SEMICONDUCTOR DEVICE

Power Semiconductor Device of Stripe Cell Geometry

ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL

INTEGRATED PIEZOELECTRIC RESONATOR AND ADDITIONAL ACTIVE CIRCUIT

METHOD FOR MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE, AND DISPLAY DEVICE

PIXEL STRUCTURE

POLAR, CHIRAL, AND NON-CENTRO-SYMMETRIC FERROELECTRIC MATERIALS, MEMORY CELLS INCLUDING SUCH MATERIALS, AND RELATED DEVICES AND METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

INTEGRATED CIRCUIT PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Silicon on Nothing Devices and Methods of Formation Thereof