| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having BVH superior in connection reliability when a hollow part is formed at a base of a non-through hole, and to provide a manufacturing method of the board. SOLUTION: In the printed wiring board, the hollow part of an insulating layer formed on the base side of a blind via hole is filled with plating of the blind via hole. The manufacturing method of the printed wiring board is to perform a processing with regular plating liquid, and to deposit plating after the hollow part is processed with plating liquid for field via until the hollow part formed on the base of the blind via hole is filled and plating is deposited. COPYRIGHT: (C)2005,JPO&NCIPI |
