| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a pattern which does not need a mask, can correspond flexibly to the change of the shape of a wiring pattern, needs only a short pattern forming time, can keep costs low, is hardly affected by dust and the surface state of an insulating substrate, saves a solution in an application process, and can form a three-dimensional pattern layer and an apparatus for the method. SOLUTION: A three-dimensional partition wall 12 surrounding a prescribed area is formed by discharging the droplets of the insulator forming solution on the insulating substrate 10. A pattern layer precursor 13 is formed by discharging the droplets of a conductor forming liquid containing conductive particles in a recessed pattern layer forming area 14 formed by being surrounded with the partition wall 12. Conductivity development treatment is applied to the precursor 13 to form a pattern layer 16 which is a conductor layer. COPYRIGHT: (C)2005,JPO&NCIPI |
